Plan Optik is driving connectivity to the next level

Elsoff. Plan Optik AG, the leading manufacturer of customized wafers from glass, quartz or glass-silicon compound materials has launched its new Cu-Interposer technology at SEMICON Europa 2019.  The progressive miniaturization, increasing integration density and requirements for more powerful signal routing create the need for 3D integration. Interposer technologies for rewiring have been developed for efficient…