Plan Optik is driving connectivity to the next level

Elsoff. Plan Optik AG, the leading manufacturer of customized wafers from glass, quartz or glass-silicon compound materials has launched its new Cu-Interposer technology at SEMICON Europa 2019.  The progressive miniaturization, increasing integration density and requirements for more powerful signal routing create the need for 3D integration. Interposer technologies for rewiring have been developed for efficient…

Glass wafers for pressure sensor applications

Sensors and Micro-Electro-Mechanical-Systems (MEMS) have changed the way how we interact with technology and how it interacts with itself and our environment. Without them we would not have smartphones, smart homes or wearable devices as smart watches as well as a huge range of industrial and medical devices that require the functionality provided by MEMS…