\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
Carrier wafers and tools<\/h1><\/div>\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n<\/div><\/div>
<\/div><\/div><\/div>\nCustomized handling solutions for wafer and panel processing \u2013 including carriers, adapters, and chucks, tailored to your production processes.<\/p>\n
PLANOPTIK supplies the largest semi\u00adcon\u00adductor manufacturers with carrier wafers that are individually adapted to the customer\u2019s manufacturing processes and machines.<\/p>\n<\/div><\/div><\/div><\/div><\/div>
\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
Carriers for the processing of
\nultra-thin wafers<\/p><\/h2><\/div>
\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
<\/div><\/div>The processing of ultra-thin wafers made from brittle materials such as silicon, silicon carbide (SiC), gallium arsenide (GaAs), and other advanced semiconductor materials requires temporary mechanical support. For this purpose, the wafers are bonded to PLANOPTIK carrier wafers during processing and debonded after completion.<\/p>\n<\/div><\/div><\/div>
![\"Carriers](\"https:\/\/planoptik.com\/wp-content\/uploads\/2026\/03\/carriers-for-ultra-thin-wafers.jpg\")
<\/span><\/div><\/div><\/div><\/div><\/div>\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
Carrier laser release<\/h4><\/div><\/div>![\"Carrier](\"https:\/\/planoptik.com\/wp-content\/uploads\/2026\/03\/carriers-laser-release.jpg\")
<\/span><\/div><\/div>For laser release processes, PLANOPTIK provides highly transparent carrier wafers that transmit the relevant laser wavelength.<\/p>\n<\/div>
\n- blank carrier wafer<\/li>\n
- easy laser release due to high transparency<\/li>\n
- borosilicate or alkaline free glass<\/li>\n<\/ul>\n<\/div><\/div><\/div>
\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
Carrier thermal release<\/h4><\/div><\/div>![\"Carrier](\"https:\/\/planoptik.com\/wp-content\/uploads\/2026\/03\/carriers-thermal-release.jpg\")
<\/span><\/div><\/div>For carrier wafers that are released again by heat after bonding, PLANOPTIK offers wafers with special surface structures.<\/p>\n<\/div>
\n- patterned carrier wafer<\/li>\n
- honeycomb pattern for homogenous adhesive distribution and lower ttv<\/li>\n
- borosilicate or alkaline free glass wafers<\/li>\n<\/ul>\n<\/div><\/div><\/div>
\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
Carrier chemical release<\/h4><\/div><\/div>![\"Carrier](\"https:\/\/planoptik.com\/wp-content\/uploads\/2026\/03\/carriers-chemical-release.jpg\")
<\/span><\/div><\/div>PLANOPTIK provides carrier wafers, which are to be chemically dissolved after the silicon wafers have been manufactured and processed, with up to 100,000 micro holes with a diameter of 100 \u00b5m through which the solvent reaches the wafer\u2019s bonding layer.<\/p>\n<\/div>
\n- perforated carrier wafer<\/li>\n
- high density through holes available<\/li>\n
- fast chemical debonding<\/li>\n
- borosilicate or alkaline free glass<\/li>\n<\/ul>\n<\/div><\/div><\/div><\/div><\/div>
\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
Customized or off the shelf<\/h2><\/div>\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n<\/div><\/div>
<\/div><\/div><\/div>\n- blank or patterned carrier wafers<\/li>\n
- custom diameters available<\/li>\n
- compatible with all common thin wafer handling systems<\/li>\n
- usable with temporary bonding and debonding<\/li>\n
- cte adapted to semiconductor device wafer<\/li>\n
- low thickness tolerance and total thickness variation<\/li>\n
- re-usable<\/li>\n
- low damage laser marking for long life<\/li>\n
- Adapter to enable handling of smaller dimensions wafers in existing equipment<\/li>\n
- high thermal and chemical stability<\/li>\n<\/ul>\n<\/div><\/div><\/div><\/div><\/div><\/div>CONTACT<\/span><\/a><\/div><\/div><\/div>
\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n<\/div><\/div>
Customized handling solutions for wafer and panel processing \u2013 including carriers, adapters, and chucks, tailored to your production processes.<\/p>\n
PLANOPTIK supplies the largest semi\u00adcon\u00adductor manufacturers with carrier wafers that are individually adapted to the customer\u2019s manufacturing processes and machines.<\/p>\n<\/div><\/div><\/div><\/div><\/div>
\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
Carriers for the processing of
\nultra-thin wafers<\/p><\/h2><\/div>
\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
The processing of ultra-thin wafers made from brittle materials such as silicon, silicon carbide (SiC), gallium arsenide (GaAs), and other advanced semiconductor materials requires temporary mechanical support. For this purpose, the wafers are bonded to PLANOPTIK carrier wafers during processing and debonded after completion.<\/p>\n<\/div><\/div><\/div>
<\/span><\/div><\/div><\/div><\/div><\/div>\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
Carrier laser release<\/h4><\/div><\/div><\/span><\/div><\/div>For laser release processes, PLANOPTIK provides highly transparent carrier wafers that transmit the relevant laser wavelength.<\/p>\n<\/div>
\n- blank carrier wafer<\/li>\n
- easy laser release due to high transparency<\/li>\n
- borosilicate or alkaline free glass<\/li>\n<\/ul>\n<\/div><\/div><\/div>
\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
Carrier thermal release<\/h4><\/div><\/div><\/span><\/div><\/div>For carrier wafers that are released again by heat after bonding, PLANOPTIK offers wafers with special surface structures.<\/p>\n<\/div>
\n- patterned carrier wafer<\/li>\n
- honeycomb pattern for homogenous adhesive distribution and lower ttv<\/li>\n
- borosilicate or alkaline free glass wafers<\/li>\n<\/ul>\n<\/div><\/div><\/div>
\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
Carrier chemical release<\/h4><\/div><\/div><\/span><\/div><\/div>PLANOPTIK provides carrier wafers, which are to be chemically dissolved after the silicon wafers have been manufactured and processed, with up to 100,000 micro holes with a diameter of 100 \u00b5m through which the solvent reaches the wafer\u2019s bonding layer.<\/p>\n<\/div>
\n- perforated carrier wafer<\/li>\n
- high density through holes available<\/li>\n
- fast chemical debonding<\/li>\n
- borosilicate or alkaline free glass<\/li>\n<\/ul>\n<\/div><\/div><\/div><\/div><\/div>
\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
Customized or off the shelf<\/h2><\/div>\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n<\/div><\/div>
<\/div><\/div><\/div>\n- blank or patterned carrier wafers<\/li>\n
- custom diameters available<\/li>\n
- compatible with all common thin wafer handling systems<\/li>\n
- usable with temporary bonding and debonding<\/li>\n
- cte adapted to semiconductor device wafer<\/li>\n
- low thickness tolerance and total thickness variation<\/li>\n
- re-usable<\/li>\n
- low damage laser marking for long life<\/li>\n
- Adapter to enable handling of smaller dimensions wafers in existing equipment<\/li>\n
- high thermal and chemical stability<\/li>\n<\/ul>\n<\/div><\/div><\/div><\/div><\/div><\/div>CONTACT<\/span><\/a><\/div><\/div><\/div>
<\/span><\/div>For laser release processes, PLANOPTIK provides highly transparent carrier wafers that transmit the relevant laser wavelength.<\/p>\n<\/div>
- \n
- blank carrier wafer<\/li>\n
- easy laser release due to high transparency<\/li>\n
- borosilicate or alkaline free glass<\/li>\n<\/ul>\n<\/div><\/div><\/div>
\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
Carrier thermal release<\/h4><\/div>
<\/div><\/span><\/div><\/div>For carrier wafers that are released again by heat after bonding, PLANOPTIK offers wafers with special surface structures.<\/p>\n<\/div>
- \n
- patterned carrier wafer<\/li>\n
- honeycomb pattern for homogenous adhesive distribution and lower ttv<\/li>\n
- borosilicate or alkaline free glass wafers<\/li>\n<\/ul>\n<\/div><\/div><\/div>
\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
Carrier chemical release<\/h4><\/div>
<\/div><\/span><\/div><\/div>PLANOPTIK provides carrier wafers, which are to be chemically dissolved after the silicon wafers have been manufactured and processed, with up to 100,000 micro holes with a diameter of 100 \u00b5m through which the solvent reaches the wafer\u2019s bonding layer.<\/p>\n<\/div>
- \n
- perforated carrier wafer<\/li>\n
- high density through holes available<\/li>\n
- fast chemical debonding<\/li>\n
- borosilicate or alkaline free glass<\/li>\n<\/ul>\n<\/div><\/div><\/div><\/div><\/div>
\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
Customized or off the shelf<\/h2><\/div>
\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n<\/div><\/div>
<\/div><\/div><\/div>- \n
- blank or patterned carrier wafers<\/li>\n
- custom diameters available<\/li>\n
- compatible with all common thin wafer handling systems<\/li>\n
- usable with temporary bonding and debonding<\/li>\n
- cte adapted to semiconductor device wafer<\/li>\n
- low thickness tolerance and total thickness variation<\/li>\n
- re-usable<\/li>\n
- low damage laser marking for long life<\/li>\n
- Adapter to enable handling of smaller dimensions wafers in existing equipment<\/li>\n
- high thermal and chemical stability<\/li>\n<\/ul>\n<\/div><\/div><\/div><\/div><\/div><\/div>CONTACT<\/span><\/a><\/div><\/div><\/div>
![\"Adapter](\"https:\/\/planoptik.com\/wp-content\/uploads\/2026\/03\/adapter-carrier.jpg\")
<\/span><\/div><\/div><\/div><\/div><\/div>