\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
Glass-core-substrates<\/h1><\/div>\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n<\/div><\/div>
![\"Glass-core-substrates\"](\"https:\/\/planoptik.com\/wp-content\/uploads\/2026\/03\/glass-core-substrates-opener.jpg\")
<\/span><\/div><\/div><\/div>PLANOPTIK develops glass-core substrates for advanced packaging, providing a high-precision platform for attaching and interconnecting microchips and semiconductor components.<\/p>\n
The glass core is processed with fine through-glass vias and copper metallization, enabling reliable routing and high-density electrical interfaces using wafer-level manufacturing and lithographic structuring.<\/p>\n<\/div><\/div><\/div><\/div><\/div>
\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
Glass-core-substrates enable chips and sensors to be stacked in the smallest of spaces.
\nIndividually developed.<\/p><\/h2><\/div>
\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n<\/div><\/div>
Discover the technologies we offer to shape Glass-Core-Substrates for Advanced Packaging. Individually deve\u00adloped and manufactured from R&D to high volumes.<\/p>\n
– THROUGH-GLASS-VIAS
\n– METALLIZIATION
\n– CAVITIES
\n– DIFFERENT GLASS TYPES
\n– MDF POLISHING
\n– MARKINGS
\n– DICING
\n– REDISTRIBUTION LAYER (RDL)
\n– SOLDER MASK<\/p>\n<\/div><\/div><\/div>
<\/div><\/div><\/div>![\"Metallisation\"](\"https:\/\/planoptik.com\/wp-content\/uploads\/2026\/03\/technologies-glass-panels-metallisation.png\")
<\/span><\/div><\/div><\/div>Metallisation<\/p>\n<\/div><\/div><\/div>
![\"Through](\"https:\/\/planoptik.com\/wp-content\/uploads\/2026\/03\/technologies-glass-panels-through-glass-vias.png\")
<\/span><\/div><\/div><\/div>Through Glass VIAS<\/p>\n<\/div><\/div><\/div>
![\"Solder](\"https:\/\/planoptik.com\/wp-content\/uploads\/2026\/03\/technologies-glass-panels-solder-mask.png\")
<\/span><\/div><\/div><\/div>Solder mask<\/p>\n<\/div><\/div><\/div>
![\"Redistribution](\"https:\/\/planoptik.com\/wp-content\/uploads\/2026\/03\/technologies-glass-panels-redistribution-layer.png\")
<\/span><\/div><\/div><\/div>Redistribution layer<\/p>\n<\/div><\/div><\/div>
![\"MDF](\"https:\/\/planoptik.com\/wp-content\/uploads\/2026\/03\/technologies-glass-panels-mdf-polishing.png\")
<\/span><\/div><\/div><\/div>MDF Polishing<\/p>\n<\/div><\/div><\/div>
![](\"https:\/\/planoptik.com\/wp-content\/uploads\/2026\/03\/technologies-glass-panels-dicing.png\")
<\/span><\/div><\/div><\/div>Dicing<\/p>\n<\/div><\/div><\/div><\/div><\/div>
![\"Glass](\"https:\/\/planoptik.com\/wp-content\/uploads\/2026\/03\/glass-for-advanced-packaging.jpg\")
<\/span><\/div><\/div><\/div>\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
Glass \u2013 the best choice
\nfor Advanced Packaging<\/p><\/h3><\/div>
Glass \u2013 the best choice for Advanced Packaging<\/h3><\/div>Glass is becoming a key material for advanced packaging and high-density interconnects. Compared to conventional organic PCB substrates, glass offers outstanding dimensional stability, electrical insulation and thermal reliability \u2013 enabling tighter layouts and more robust packages.<\/p>\n
Key advantages of glass vs. classic PCBs:<\/p>\n
\n- Higher dimensional stability for fine-pitch routing and accurate alignment<\/li>\n
- Excellent electrical insulation with low signal losses at high frequencies<\/li>\n
- Low CTE and high thermal stability for reduced warpage and improved reliability<\/li>\n
- High stiffness and flatness for advanced assembly and multi-chip integration<\/li>\n
- High-precision through-glass vias (TGVs) for vertical interconnects and dense I\/O<\/li>\n<\/ul>\n
These properties make glass-core substrates an ideal platform for next-generation semiconductor packaging, especially for high-performance computing and RF applications.<\/p>\n<\/div><\/div><\/div><\/div><\/div>
![\"3D](\"https:\/\/planoptik.com\/wp-content\/uploads\/2026\/03\/3d-packaging-using-glass.png\")
<\/span><\/div><\/div><\/div>\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
3D Packaging based on
\nglass-core-substrates<\/p><\/h3><\/div>
3D Packaging based on glass-core-substrates<\/h3><\/div>Glass-core-substrates are used in advanced packaging to connect and integrate multiple chips and electronic compo\u00adnents in one compact module. Acting as a high-precision interconnect platform, they enable dense routing and reliable signal transmission \u2013 especially when space is limited and performance requirements are high.<\/p>\n
This makes glass-core-substrates ideal for next-generation electronics such as AI hardware, high-speed data communi\u00adcation, and RF applications, where smaller, faster and more energy-efficient devices are required.<\/p>\n<\/div><\/div><\/div>
<\/span><\/div><\/div><\/div><\/div><\/div>\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
Interposers
\nand structured
\nglass-core-substrates<\/h1><\/div>\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n<\/div><\/div>
A key application for glass-core-substrates is interposers. Interposers act as high-density routing layers that connect multiple chips within one package, enabling compact multi-chip modules and 2.5D integration. PLANOPTIK manufactures glass interposers using wafer-based processes.<\/p>\n<\/div><\/div><\/div><\/div><\/div>
\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
How to create a glass core substrate<\/h3><\/div><\/div><\/div>![\"Glass](\"https:\/\/planoptik.com\/wp-content\/uploads\/2026\/03\/how-to-create-an-interposer-1.png\")
<\/span><\/div><\/div>Glass wafer with micro holes, copper coated<\/p>\n<\/div><\/div><\/div>
![\"Wafer](\"https:\/\/planoptik.com\/wp-content\/uploads\/2026\/03\/how-to-create-an-interposer-2.png\")
<\/span><\/div><\/div>Wafer additionally coated with solder resist<\/p>\n<\/div><\/div><\/div>
![\"Interposer](\"https:\/\/planoptik.com\/wp-content\/uploads\/2026\/03\/how-to-create-an-interposer-3.png\")
<\/span><\/div><\/div>Interposer after dicing<\/p>\n<\/div><\/div><\/div><\/div><\/div>
\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
Your personal advisor<\/h3><\/div><\/div><\/div>![\"Jonas](\"https:\/\/planoptik.com\/wp-content\/uploads\/2025\/03\/jonas-discher-planoptik.png\")
<\/span><\/div><\/div><\/div>Jonas Discher<\/p>\n<\/div>
\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n<\/div><\/div>
<\/span><\/div><\/div><\/div>PLANOPTIK develops glass-core substrates for advanced packaging, providing a high-precision platform for attaching and interconnecting microchips and semiconductor components.<\/p>\n
The glass core is processed with fine through-glass vias and copper metallization, enabling reliable routing and high-density electrical interfaces using wafer-level manufacturing and lithographic structuring.<\/p>\n<\/div><\/div><\/div><\/div><\/div>
\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
Glass-core-substrates enable chips and sensors to be stacked in the smallest of spaces.
\nIndividually developed.<\/p><\/h2><\/div>
\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n<\/div><\/div>
Discover the technologies we offer to shape Glass-Core-Substrates for Advanced Packaging. Individually deve\u00adloped and manufactured from R&D to high volumes.<\/p>\n
– THROUGH-GLASS-VIAS
\n– METALLIZIATION
\n– CAVITIES
\n– DIFFERENT GLASS TYPES
\n– MDF POLISHING
\n– MARKINGS
\n– DICING
\n– REDISTRIBUTION LAYER (RDL)
\n– SOLDER MASK<\/p>\n<\/div><\/div><\/div>
<\/span><\/div>Metallisation<\/p>\n<\/div><\/div><\/div>
<\/span><\/div>Through Glass VIAS<\/p>\n<\/div><\/div><\/div>
<\/span><\/div>Solder mask<\/p>\n<\/div><\/div><\/div>
<\/span><\/div>Redistribution layer<\/p>\n<\/div><\/div><\/div>
<\/span><\/div>MDF Polishing<\/p>\n<\/div><\/div><\/div>
<\/span><\/div>Dicing<\/p>\n<\/div><\/div><\/div><\/div><\/div>
<\/span><\/div><\/div><\/div>\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
Glass \u2013 the best choice
\nfor Advanced Packaging<\/p><\/h3><\/div>
Glass \u2013 the best choice for Advanced Packaging<\/h3><\/div>Glass is becoming a key material for advanced packaging and high-density interconnects. Compared to conventional organic PCB substrates, glass offers outstanding dimensional stability, electrical insulation and thermal reliability \u2013 enabling tighter layouts and more robust packages.<\/p>\n
Key advantages of glass vs. classic PCBs:<\/p>\n
\n- Higher dimensional stability for fine-pitch routing and accurate alignment<\/li>\n
- Excellent electrical insulation with low signal losses at high frequencies<\/li>\n
- Low CTE and high thermal stability for reduced warpage and improved reliability<\/li>\n
- High stiffness and flatness for advanced assembly and multi-chip integration<\/li>\n
- High-precision through-glass vias (TGVs) for vertical interconnects and dense I\/O<\/li>\n<\/ul>\n
These properties make glass-core substrates an ideal platform for next-generation semiconductor packaging, especially for high-performance computing and RF applications.<\/p>\n<\/div><\/div><\/div><\/div><\/div>
<\/span><\/div><\/div><\/div>\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
3D Packaging based on
\nglass-core-substrates<\/p><\/h3><\/div>
3D Packaging based on glass-core-substrates<\/h3><\/div>Glass-core-substrates are used in advanced packaging to connect and integrate multiple chips and electronic compo\u00adnents in one compact module. Acting as a high-precision interconnect platform, they enable dense routing and reliable signal transmission \u2013 especially when space is limited and performance requirements are high.<\/p>\n
This makes glass-core-substrates ideal for next-generation electronics such as AI hardware, high-speed data communi\u00adcation, and RF applications, where smaller, faster and more energy-efficient devices are required.<\/p>\n<\/div><\/div><\/div>
<\/span><\/div><\/div><\/div><\/div><\/div>\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
Interposers
\nand structured
\nglass-core-substrates<\/h1><\/div>\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n<\/div><\/div>
A key application for glass-core-substrates is interposers. Interposers act as high-density routing layers that connect multiple chips within one package, enabling compact multi-chip modules and 2.5D integration. PLANOPTIK manufactures glass interposers using wafer-based processes.<\/p>\n<\/div><\/div><\/div><\/div><\/div>
\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
How to create a glass core substrate<\/h3><\/div><\/div><\/div><\/span><\/div><\/div>Glass wafer with micro holes, copper coated<\/p>\n<\/div><\/div><\/div>
<\/span><\/div><\/div>Wafer additionally coated with solder resist<\/p>\n<\/div><\/div><\/div>
<\/span><\/div><\/div>Interposer after dicing<\/p>\n<\/div><\/div><\/div><\/div><\/div>
\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
Your personal advisor<\/h3><\/div><\/div><\/div><\/span><\/div><\/div><\/div>Jonas Discher<\/p>\n<\/div>
Glass is becoming a key material for advanced packaging and high-density interconnects. Compared to conventional organic PCB substrates, glass offers outstanding dimensional stability, electrical insulation and thermal reliability \u2013 enabling tighter layouts and more robust packages.<\/p>\n
Key advantages of glass vs. classic PCBs:<\/p>\n
- \n
- Higher dimensional stability for fine-pitch routing and accurate alignment<\/li>\n
- Excellent electrical insulation with low signal losses at high frequencies<\/li>\n
- Low CTE and high thermal stability for reduced warpage and improved reliability<\/li>\n
- High stiffness and flatness for advanced assembly and multi-chip integration<\/li>\n
- High-precision through-glass vias (TGVs) for vertical interconnects and dense I\/O<\/li>\n<\/ul>\n
These properties make glass-core substrates an ideal platform for next-generation semiconductor packaging, especially for high-performance computing and RF applications.<\/p>\n<\/div><\/div><\/div><\/div><\/div>
<\/span><\/div><\/div><\/div>\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
3D Packaging based on
\nglass-core-substrates<\/p><\/h3><\/div>3D Packaging based on glass-core-substrates<\/h3><\/div>
Glass-core-substrates are used in advanced packaging to connect and integrate multiple chips and electronic compo\u00adnents in one compact module. Acting as a high-precision interconnect platform, they enable dense routing and reliable signal transmission \u2013 especially when space is limited and performance requirements are high.<\/p>\n
This makes glass-core-substrates ideal for next-generation electronics such as AI hardware, high-speed data communi\u00adcation, and RF applications, where smaller, faster and more energy-efficient devices are required.<\/p>\n<\/div><\/div><\/div>
<\/span><\/div><\/div><\/div><\/div><\/div>\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
Interposers
\nand structured
\nglass-core-substrates<\/h1><\/div>\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n<\/div><\/div>
A key application for glass-core-substrates is interposers. Interposers act as high-density routing layers that connect multiple chips within one package, enabling compact multi-chip modules and 2.5D integration. PLANOPTIK manufactures glass interposers using wafer-based processes.<\/p>\n<\/div><\/div><\/div><\/div><\/div>
\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
How to create a glass core substrate<\/h3><\/div><\/div><\/div>
<\/span><\/div><\/div>Glass wafer with micro holes, copper coated<\/p>\n<\/div><\/div><\/div>
<\/span><\/div><\/div>Wafer additionally coated with solder resist<\/p>\n<\/div><\/div><\/div>
<\/span><\/div><\/div>Interposer after dicing<\/p>\n<\/div><\/div><\/div><\/div><\/div>
\u2013<\/p>\n<\/div>
\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n
Your personal advisor<\/h3><\/div><\/div><\/div>
<\/span><\/div><\/div><\/div>Jonas Discher<\/p>\n<\/div>
![\"Team](\"https:\/\/planoptik.com\/wp-content\/uploads\/2025\/01\/individually-developed-with-planoptik.jpg\")
<\/span><\/div><\/div><\/div>![\"Team](\"https:\/\/planoptik.com\/wp-content\/uploads\/2025\/01\/team-up-until-production.jpg\")
<\/span><\/div><\/div><\/div>