Plan Optik AG presents Volume Laser Induced Structuring (VLIS), a next-generation solution designed to meet the demands of cutting-edge semiconductor applications. VLIS exemplifies advanced glass processing expertise, delivering unmatched performance and integration flexibility.
The Importance of Through-Glass Vias (TGVs)
Through-Glass Vias (TGVs) play a critical role in modern semiconductor applications, particularly in high-frequency and high-density interconnect scenarios. TGVs are the prerequisite for vertical electrical connections through glass substrates, which is essential for 3D integration and advanced packaging solutions. Metallized TGVs provide the necessary paths for electrical signals and ensure efficient communication between different layers of a device.
VLIS: The Plan Optik Solution
VLIS technology addresses stringent industry requirements by offering a method to structure glass for high-density designs, including the creation of high-quality through holes, cavities, and blind holes. VLIS substrates are engineered to deliver exceptional electrical performance, thermal stability, and mechanical strength, making them ideal for applications demanding precise and durable interposer solutions.
VLIS is already making a substantial impact in the industry, demonstrating its value in various high-demand applications.
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