– cte adapted to Silicon
– for anodic bonding
– standard or enhanced MDF (micro-damage-free) polishing
– high chemical resistance and thermal stability
– cte adapted to Silicon
– for anodic bonding
– standard or enhanced MDF (micro-damage-free) polishing
– high chemical resistance and thermal stability
– very low OH and low trace metal content
– good chemical purity
– very high heat resistance
– surface roughness (Ra) < 0.5 nm
– transmission > 80% @ 200 nm
– transmission > 90% from 225 nm to 2600 nm
– full synthetic material
– very low trace metal content
– high heat resistance
– surface roughness (Ra) < 0.5 nm
– transmission > 80% @ 185 nm
– transmission > 90% from 200 nm to 2000 nm
– alkaline free Glass
– cte adapted to Silicon
– no heavy metasl (as arsenic, antimony, barium or halides)
– low fluorescence
– excellent thermal properties
– high chemical resistance
– crystalline Silicon layer
– thick insulation layer or thick Silicon layer
– permanently bonded Silicon/Glass compound
– minimum single layer thickness down to 20 µm
– overall thickness down to 250 µm