Glass wafers and panels for wafer-level packaging

Wafer-level packaging

PLANOPTIK supplies customized glass wafers and panels for wafer-level packaging – designed to protect, encapsulate and enable MEMS devices and photonic applications. From thin cover wafers to functional glass structures, we deliver the substrate your process needs.

Customized glass wafers and panels for wafer-level packaging-engineered for MEMS and photonics. From thin cover wafers to functional glass structures, PLANOPTIK enables reliable protection and integra­tion at wafer level.

Customized wafers and panels
to cover your MEMS devices
by glass

Discover the technologies we offer to shape glass wafers for your WLP application. Individually developed and manufactured from R&D to high volumes.

– THROUGH GLASS VIAS
– CAVITIES
– BLIND HOLES
– CHANNELS
– DIFFERENT GLASS TYPES
– MDF POLISHING
– MARKINGS
– COATINGS
– DICING
– BONDING

Through Glass VIAS

Through Glass VIAS

Cavities

Cavities

Blind holes

Blind holes

Channels

Channels

MDF Polishing

MDF Polishing

Bonding

From glass wafers to functional
sensors and MEMS devices
by wafer-level packaging

From glass wafers to functional sensors and MEMS devices by wafer-level packaging

Case study: Glass wafers for covering and protecting optical sensors

Case study
Case study
Case study
Case study

Optical sensors often require a transparent, mechanically stable and contamination-resistant cover at wafer level. PLANOPTIK provides customized glass cap wafers – either as blank glass for protection or as structured glass with cavities, channels or blind holes for added functionality.

During assembly, the glass wafer is aligned and bonded to the sensor wafer, forming a robust glass–silicon stack. After bonding, the stack is diced into individual dies, automatically encapsulating and protecting each sensor with its glass cap.

These optical sensor modules are used in industrial inspection and automation, medical imaging, consumer electronics, and automotive camera systems – where clean optics and long-term stability are critical.

Application examples for electromechanical sensors

Your personal advisor

Jonas Discher

Team up with PLANOPTIK

Team up with PlanOptik
Team up with PlanOptik

Individually developed

Are you developing a new microsystem? Are you combining microelectronics, micromecha­nics or microfluidics to create a new product? Are you developing a sensor, an electronic device, a fluidic system or something that has never existed before? Team up with PLANOPTIK.

Reliable partnership

In us you will find a partner who will work with you to develop electronic, mechanical, optical, chemical or biological microcomponents and has a firm grasp of materials such as glass, silicon and copper.

Team up with PlanOptik

Together until production

PLANOPTIK also manufactures the jointly deve­loped microcomponents and elements in high volumes using state-of-the-art wafer-based manufacturing processes.