Plan Optik AG offers re-usable carriers for thin wafer handling which can be used for mechanical release of the device wafers. There is an ongoing wafer thickness reduction in the semiconductor industry since years. The market is demanding for smaller devices, cost reduction and increased number of functions. Therefore smaller package sizes need to be…
Plan Optik AG offers Carrier Wafers which enable handling of smaller diameter wafers and a variety of substrates with different dimensions. With increasing diameter of wafers processed in semiconductor industry not everyone can afford processing equipment or tools for different wafer diameter or even customized substrate dimensions. Plan Optik‘s Adapter Carriers feature pockets to hold…
From now on Plan Optik AG, the leading manufacturer of glass and quartz wafers, offers re-usable carriers for thin wafer handling which can be used for chemical release of device wafers. There has been an ongoing wafer thickness reduction in the semiconductor industry since many years. The market has demanded smaller devices, cost reductions and…
Plan Optik AG the leading manufacturer of glass and quartz wafers now offers fused silica wafers from one of the purest materials: ULTRA HIGH PURITY FUSED SILICA. Ultra High Purity Fused Silica has an impurity level (trace metal content) of less than 0.2 ppm. This is the lowest impurity level available in the market which…
