Plan Optik is driving connectivity to the next level
Elsoff. Plan Optik AG, the leading manufacturer of customized wafers from glass, quartz or glass-silicon compound materials has launched its new Cu-Interposer technology at SEMICON Europa 2019. The progressive miniaturization, increasing integration density and requirements for more powerful signal routing create the need for 3D integration. Interposer technologies for rewiring have been developed for efficient…
Glass wafers for pressure sensor applications
Sensors and Micro-Electro-Mechanical-Systems (MEMS) have changed the way how we interact with technology and how it interacts with itself and our environment. Without them we would not have smartphones, smart homes or wearable devices as smart watches as well as a huge range of industrial and medical devices that require the functionality provided by MEMS…
Carrier Wafer – a useful and necessary tool for MEMS and Sensor Packaging
1. Introduction There is ongoing wafer thickness reduction in the MEMS and semiconductor industry. This is because of market demand for smaller devices that afford an increased number of functionalities at reduced cost; and for this, smaller package sizes need to be realised. It is mainly consumer applications that are responsible for this trend, but…
Carriers for mechanical release – Thin wafer handling
Plan Optik AG offers re-usable carriers for thin wafer handling which can be used for mechanical release of the device wafers. There is an ongoing wafer thickness reduction in the semiconductor industry since years. The market is demanding for smaller devices, cost reduction and increased number of functions. Therefore smaller package sizes need to be…
Adapter Carriers – Maximum Flexibility
Plan Optik AG offers Carrier Wafers which enable handling of smaller diameter wafers and a variety of substrates with different dimensions. With increasing diameter of wafers processed in semiconductor industry not everyone can afford processing equipment or tools for different wafer diameter or even customized substrate dimensions. Plan Optik‘s Adapter Carriers feature pockets to hold…
Thin wafer handling – Carriers for chemical release
From now on Plan Optik AG, the leading manufacturer of glass and quartz wafers, offers re-usable carriers for thin wafer handling which can be used for chemical release of device wafers. There has been an ongoing wafer thickness reduction in the semiconductor industry since many years. The market has demanded smaller devices, cost reductions and…
Ultra high purity fused silica (UV grade fused silica)
Plan Optik AG the leading manufacturer of glass and quartz wafers now offers fused silica wafers from one of the purest materials: ULTRA HIGH PURITY FUSED SILICA. Ultra High Purity Fused Silica has an impurity level (trace metal content) of less than 0.2 ppm. This is the lowest impurity level available in the market which…