What are MEMS Microphones? MEMS Microphones are crafted using the advanced MEMS (Microelectromechanical systems) technologies. The heart of a MEMS Microphone is the sound sensing element, primarily formed from a silicon device wafer, which is further enclosed by a top-tier borosilicate glass wafer. How do MEMS Microphones work? Within the silicon device wafer lies a…
What are MEMS Gyroscopes? MEMS Gyroscopes are used for the detection of yaw-rate respectively angular-rate. They are manufactured by using MEMS (Microelectromechanical systems) technologies. The core part of a MEMS Gyroscope is an angular-rate sensing die based on a silicon device wafer, encapsulated by a high quality borosilicate glass wafer. General process flow How do…
What are Adapter Carriers? Adapter Carriers are customized tools enabling processing of smaller sized substrates or device wafers on bigger sized equipment (e.g. 6 inch device wafer on 8 inch equipment). The carrier diameter and thickness is matched to existing process tools such as thinning, dry etching, coating, implant, metal deposition, probing, etc.. What materials…
What are Thin-Wafer-Handling Carriers? Thin-Wafer-Handling Carriers are tools that are used as Carriers in the manufacture of thin semiconductor wafers. Without the use of such Carriers, production and handling of very thin semiconductor wafers (down to approx. 50 microns) would be unthinkable. How do Thin-Wafer-Handling Carriers work? The device wafer is temporarily bonded to…
Plan Optik AG (Elsoff, Germany) and 4JET microtech (Alsdorf, Germany) have jointly developed a process chain for the highly productive production of metallized through-glass vias. The new VLIS process (short for Volume Laser Induced Structuring) enables the production of high-precision TGV (“Through Glass Vias”) for advanced packaging in glass wafers, or substrates for displays. TGV…
What are MEMS Pressure Sensors? MEMS Pressure Sensors are manufactured by using MEMS (Microelectromechanical systems) technologies. The core part of a MEMS Pressure Sensor is a pressure sensing die based on a silicon device wafer, encapsulated by a high quality borosilicate glass wafer. How do MEMS Pressure Sensors work? A membrane inside the silicon…
Plan Optik is the leading manufacturer of customized glass wafers. In sectors such as consumer electronics, automotive, aerospace, chemistry and pharmaceuticals these wafers are essential components for numerous applications in MEMS technology. The wafers of glass, glass-silicon compoundfs or quartz are available in sizes up to 300 mm diameter. Wafers by Plan Optik provide high-precision…
Gallium arsenide (GaAs) is used in the manufacture of devices such as microwave frequency integrated circuits, monolithic microwave integrated circuits, infrared light-emitting diodes, laser diodes, solar cells and optical windows. Handling and processing thin GaAs wafers is usually enabled by using a sapphire wafer as a carrier, which is expensive and need to be refurbished…
Plan Optik is very proud, overjoyed and honored to accept the 2021 3DInCites award in the category “Material Supplier of the year”! Many thanks to everyone who voted for us! About 3DInCites Awards: “The 2021 3D InCites Awards program recognized industry-wide contributions in the development of heterogeneous integration and 3D technologies. We…
Plan Optik AG, the leading manufacturer of structured wafers from glass, quartz and glass-silicon compound materials, has been nominated for the 2021 3DInCites Awards in the category “MATERIALS SUPPLIER OF THE YEAR“! Winners will be chosen by a select panel of judges, as well as industry peers through an online voting process. Online voting for the…
