NEWS

Plan Optik becomes PLANOPTIK

General12. July 2024

We have a new name. Plan Optik AG was renamed PLANOPTIK AG at the last Annual General Meeting. At the same time as the change of name, the PLANOPTIK Group is also getting a new logo. With the new brand, a new appearance and an overall new image, we want to be even better recognized…

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Pioneering Volume Laser Induced Structuring (VLIS) Technology

General11. July 2024

Plan Optik AG presents Volume Laser Induced Structuring (VLIS), a next-generation solution designed to meet the demands of cutting-edge semiconductor applications. VLIS exemplifies advanced glass processing expertise, delivering unmatched performance and integration flexibility. The Importance of Through-Glass Vias (TGVs) Through-Glass Vias (TGVs) play a critical role in modern semiconductor applications, particularly in high-frequency and high-density…

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The growing importance of Glass Substrates in Semiconductor Technology

General19. June 2024

The semiconductor industry is experiencing a significant shift towards the use of glass substrates, driven by their superior performance characteristics and suitability for high-frequency applications. As these trends gain momentum, Plan Optik AG is poised to play a critical role, thanks to its extensive expertise in glass wafer and panel manufacturing. The Rise of Glass…

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Discover Wafer Universe: Your Premier Source for Standardized Wafers

cat_Business, General14. February 2024

Dear Valued Customers and Partners, Plan Optik AG is excited to introduce Wafer Universe, crafted to meet the urgent needs for standardized wafers with a focus on streamlining procurement and ensuring rapid delivery. Product Offerings: Borofloat33® Glass Wafers: Ideal for a wide range of applications, including Wafer-Level-Packaging (WLP) of MEMS components by anodic bonding. Quartz…

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GLASS WAFERS FOR MEMS MICROPHONES

cat_application, General30. November 2023

What are MEMS Microphones? MEMS Microphones are crafted using the advanced MEMS (Microelectromechanical systems) technologies. The heart of a MEMS Microphone is the sound sensing element, primarily formed from a silicon device wafer, which is further enclosed by a top-tier borosilicate glass wafer. How do MEMS Microphones work? Within the silicon device wafer lies a…

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MEMS GYROSCOPES

cat_application, General5. October 2023

What are MEMS Gyroscopes? MEMS Gyroscopes are used for the detection of yaw-rate respectively angular-rate. They are manufactured by using MEMS (Microelectromechanical systems) technologies. The core part of a MEMS Gyroscope is an angular-rate sensing die based on a silicon device wafer, encapsulated by a high quality borosilicate glass wafer. General process flow How do…

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ADAPTER CARRIER

cat_application, General8. August 2023

What are Adapter Carriers? Adapter Carriers are customized tools enabling processing of smaller sized substrates or device wafers on bigger sized equipment (e.g. 6 inch device wafer on 8 inch equipment). The carrier diameter and thickness is matched to existing process tools such as thinning, dry etching, coating, implant, metal deposition, probing, etc.. What materials…

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THIN WAFER HANDLING CARRIER

cat_application, cat_Business6. June 2023

What are Thin-Wafer-Handling Carriers? Thin-Wafer-Handling Carriers are tools that are used as Carriers in the manufacture of thin semiconductor wafers. Without the use of such Carriers, production and handling of very thin semiconductor wafers (down to approx. 50 microns) would be unthinkable. How do Thin-Wafer-Handling Carriers work? The device wafer is temporarily bonded to…

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VLIS has arrived!

cat_Business, General4. April 2023

Plan Optik AG (Elsoff, Germany) and 4JET microtech (Alsdorf, Germany) have jointly developed a process chain for the highly productive production of metallized through-glass vias. The new VLIS process (short for Volume Laser Induced Structuring) enables the production of high-precision TGV (“Through Glass Vias”) for advanced packaging in glass wafers, or substrates for displays. TGV…

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MEMS Pressure Sensors

cat_application, General16. February 2023

What are MEMS Pressure Sensors? MEMS Pressure Sensors are manufactured by using MEMS (Microelectromechanical systems) technologies. The core part of a MEMS Pressure Sensor is a pressure sensing die based on a silicon device wafer, encapsulated by a high quality borosilicate glass wafer. How do MEMS Pressure Sensors work? A membrane inside the silicon…

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YOUR PARTNER FOR COPPER COATED GLASS WAFER AND CU-INTERPOSER

cat_Business, cat_products, General6. October 2022

Plan Optik is the leading manufacturer of customized glass wafers. In sectors such as consumer electronics, automotive, aerospace, chemistry and pharmaceuticals these wafers are essential components for numerous applications in MEMS technology. The wafers of glass, glass-silicon compoundfs or quartz are available in sizes up to 300 mm diameter. Wafers by Plan Optik provide high-precision…

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Glass Carriers for GaAs wafer processing

cat_products, General27. April 2022

Gallium arsenide (GaAs) is used in the manufacture of devices such as microwave frequency integrated circuits, monolithic microwave integrated circuits, infrared light-emitting diodes, laser diodes, solar cells and optical windows. Handling and processing thin GaAs wafers is usually enabled by using a sapphire wafer as a carrier, which is expensive and need to be refurbished…

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MATERIALS SUPPLIER OF THE YEAR!

cat_Business27. May 2021

Plan Optik is very proud, overjoyed and honored to accept the 2021 3DInCites award in the category “Material Supplier of the year”! Many thanks to everyone who voted for us! About 3DInCites Awards: “The 2021 3D InCites Awards program recognized industry-wide contributions in the development of heterogeneous integration and 3D technologies. We…

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WE ARE NOMINATED!

cat_Business, General18. March 2021

Plan Optik AG, the leading manufacturer of structured wafers from glass, quartz and glass-silicon compound materials, has been nominated for the 2021 3DInCites Awards in the category “MATERIALS SUPPLIER OF THE YEAR“! Winners will be chosen by a select panel of judges, as well as industry peers through an online voting process. Online voting for the…

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ARCHIV

UPCOMING EVENTS

MicroTech UK | March 20 – 20, 2025 | Aerospace Bristol Museum | Leicester, UK
Flow Chemistry Europe | April 03 – 04, 2025 | Hotel ILUNION Málaga | Malaga, Spain
Smart System Integration | April 08 – 10, 2025 | Prague Congress Centre | Prague, Czech Republic
IVAM Hightech Summit | May 21 – 22, 2025 | Signal Iduna Park | Dortmund, Germany
IEEE – ECTC | May 27 – 30, 2025 | Gaylord Texan Resort & Convention Center | Dallas (TX), USA
3D & Systems Summit | June 25 – 27, 2025 | Hilton Dresden Hotel | Dresden, Germany
SEMICON Taiwan | September 10 – 12, 2025 | TaiNEX | Taipei, Taiwan
Analytica USA | September 10 – 12, 2025 | Greater Columbus Convention Center (GCCC) | Columbus (OH), USA
SEMICON West | October 07 – 09, 2025 | Phoenix Convention Center | Phoenix (AZ), USA
SEMICON Europa | November 18 – 21, 2025 | Messe München | Munich, Germany
Waferbond | December 03 – 04, 2025 | Chemnitz, Germany

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YOU WILL ALSO FIND US HERE

ECS Brokerage Event | February 18 – 19, 2025 | Le Plaza, Brussels | Brussels, Belgium
IMAPS Device Packaging Conference | March 03 – 06, 2025 | Sheraton Grand at Wild Horse Pass | Phoenix (AZ), USA
European Conference on Pharmaceutics | March 24 – 25, 2025 | Alfândega do Porto | Porto, Portugal
MEMS & Sensors Technical Congress | March 26 – 27, 2025 | Georgia Institute of Technology | Atlanta (GA), USA

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