Exactly adapted to customer requirements, Plan Optik’s packaging wafers impress with their extremely high accuracy.
Packaging wafers made of glass – Plan Optik’s product range
Plan Optik manufactures wafers for wafer level packaging from various types of glass, quartz, alkaline free glass and glass-silicon compound materials. Depending on customer specifications, Plan Optik’s packaging wafer can be patterned with through holes, cavities, trenches / channels or whatever a customer needs.
Featured Products
WAFERS WITH THROUGH HOLES
– straight, tapered or hourglass shaped through holes
– hole diameter from 50 microns
– high density
– combination with other patterning technologies available
WAFERS WITH CAVITIES
– optical cavities with transparent bottom
– cavity size from 20 microns
– deep cavities (up to 2 mm depth)
– cavities with high aspect ratio
– high density
– combination with other patterning technologies available
WAFERS WITH CHANNELS
– mechanically patterned, lasered or wet-etched trenches and channels
– high aspect ratio available
– channel width from 20 microns
– deep channels (up to 2 mm depth)
– combination with other patterning technologies available
Properties of Plan Optik’s packaging wafers
- patterned (bulk micro machined) Wafers from Glass, Quartz, Silicon and compounds
- Wafer diameter from 2” to 300 mm
- thickness from 200 µm to 2 mm
- used in Wafer-Level-Packaging (WLP)
- with through holes, (optical quality) cavities and trenches
- customer specific designs, patterns and alignment features
- mechanical or laser patterning or wet-etching
- high accuracy and low tolerance
- optional coatings available
Application for packaging wafers
Plan Optik has been using its expert knowledge in processing glass for wafer level packaging of MEMS for many years. With unique manufacturing processes, the wafer manufacturer is able to generate high accuracy and low tolerances.
Using the wafer level packaging approach for pressure sensor manufacturing
Blank glass wafers are used as substrates to manufacture MEMS sensors and membranes whereas patterned wafers, so-called packaging wafers with cavities or through holes, are used to encapsulate the pressure sensor die. Cavities can be used to encapsulate a reference pressure, and through holes connect the membrane to the environment to enable pressure measurement. The encapsulation is done by using a wafer level packaging (WLP) approach. Often, anodic bonding between the sensor from silicon and cap-wafers from glass is used to create a hermetic encapsulation. Therefore, Plan Optik uses cte adapted materials. After packaging, the dies are separated by dicing the wafer.
If you have a product idea or a project please do not hesitate to contact us!