– straight, tapered or hourglass shaped through holes
– hole diameter from 50 microns
– high density
– combination with other patterning technologies available
Featured Products
WAFERS WITH CAVITIES
– optical cavities with transparent bottom
– cavity size from 20 microns
– deep cavities (up to 2 mm depth)
– cavities with high aspect ratio
– high density
– combination with other patterning technologies available
WAFERS WITH CHANNELS
– mechanically patterned, lasered or wet-etched trenches and channels
– high aspect ratio available
– channel width from 20 microns
– deep channels (up to 2 mm depth)
– combination with other patterning technologies available
General properties
- patterned (bulk micro machined) Wafers from Glass, Quartz, Silicon and compounds
- Wafer diameter from 2” to 300 mm
- thickness from 200 µm to 2 mm
- used in Wafer-Level-Packaging (WLP)
- with through holes, (optical quality) cavities and trenches
- customer specific designs, patterns and alignment features
- mechanical or laser patterning or wet-etching
- high accuracy and low tolerance
- optional coatings available