What are Thin-Wafer-Handling Carriers?
Thin-Wafer-Handling Carriers are tools that are used as Carriers in the manufacture of thin semiconductor wafers. Without the use of such Carriers, production and handling of very thin semiconductor wafers (down to approx. 50 microns) would be unthinkable.
How do Thin-Wafer-Handling Carriers work?
The device wafer is temporarily bonded to the Carrier. As a result, the device wafer can be processed with conventional semiconductor processing systems without running the risk of being damaged due to its small thickness in the process.
What materials and sizes are available?
Thin-Wafer-Handling Carriers can be made from various materials. The Carrier material is adapted to the thermal expansion (cte) of the device wafer. This includes carrier materials adapted to Silicon, GaAs, SiC and many others. Carriers are available up to a diameter of 300mm. There are different Carrier types for all commercially available debonding systems (e.g. chemical debonding, laser debonding, thermal debonding and mechanical debonding).
What are the benefits of using Plan Optik’s Thin-Wafer-Handling Carriers?
Plan Optik’s Thin-Wafer-Handling Carriers are characterized by their large number of variants and, in particular, by their stability and thus high reuse rate (typically more than 50 times). Thanks to many years of expertise in the field of such Carriers, Plan Optik is able to offer solutions that are specifically tailored to customer needs.
Available products at Plan Optik:
- Chemical release Carrier
- Laser release Carrier
- Thermal release Carrier
- Mechanical release Carrier