– perforated Carrier Wafer
– high density through holes available
– fast chemical debonding
– borosilicate or alkaline free Glass
– perforated Carrier Wafer
– high density through holes available
– fast chemical debonding
– borosilicate or alkaline free Glass
– patterned Carrier Wafer
– honeycomb pattern for homogenous adhesive distribution and lower ttv
– borosilicate or alkaline free Glass Wafers
– blank Carrier Wafer
– easy laser release due to high transparency
– borosilicate or alkaline free Glass
– blank Carrier Wafer
– easy mechanical release due to smooth surface
– borosilicate or alkaline free Glass
– Adapter carrier with pocket to hold smaller dimension
– enable handling of smaller diameter Wafers inside existing equipment
– adapt from various dimensions and shapes to standard Wafer diameters
– optional through holes for vacuum chucking and clamping
– from Glass, Silicon or Glass-Silicon compound
– Chucks and Tools for Semiconductor manufacturing equipment
– from Glass, Quartz, Silicon and compounds
– with pockets, through holes and vacuum groves