The advantages of glass for the production of Carrier Wafers
Glass is used as a carrier wafer material due to its mechanical stability and chemical resistance. All Plan Optik Carrier Wafers can be reused up to 30 times (depending on the details of the use process). In order to reduce the risk of bow or warp, the cte-match between semiconductor device wafers from e.g. Si, GaAs, InP or SiC can be adjusted by using different types of glass. The transparency of glass is not only used for the laser debonding process but furthermore for in-process inspection. Also, laser markings or QR-codes can be implemented for process traceability.
Carrier Wafers for different debonding applications
During processing, the Carrier Wafer is used as a mechanical and handling support. It can be detached after processing. In doing so, different debonding technologies are used depending on the adhesive technique chosen. Plan Optik offers the plain carrier (excluding the adhesives) but closely cooperates with adhesive and equipment makers. These are the different possibilities of debonding Carrier Wafers:
- Carriers for chemical release
Using a chemical release process, a solvent gets in contact with the adhesive and releases it. For this type of debonding, thousands of holes through the Carrier Wafer enable consistent contact and fast decomposition of the adhesive.
- Carrier for laser release
After processing, the adhesive interlayer will be exposed by using a laser. After exposure, the interlayer will lose its adhesion and the device and Carrier Wafers can be separated.
- Carriers for thermal release
By heating up the processed wafer stack, the adhesive interlayer will lose its adhesion and the device wafer can be released from the carrier by a so-called shear or slide-off debond.
Request a quote to include Carrier Wafers in your process
If you are interested to learn more about carriers for temporary bonding and debonding as well as how these carriers can be applied to your thin wafer handling process make sure to contact us!