As technology is rapidly moving forward, developers are aiming to implement as many chips and sensors as possible in the smallest spaces. The reduction of device and chip size plays an important role in enabling this implementation. For this reason, thickness reduction of the semiconductor wafers is requested in industrial or scientific applications like MEMs or optics. Thin semiconductor wafers are flexible and fragile. A temporary mechanical stabilization is needed in order to enable processing of the wafer and to further decrease device wafer thickness.
For this purpose, Plan Optik provides Carrier Wafers.
Carriers & tools for Thin Wafer Handling
The wafer manufacturer produces Carrier Wafers, which can be debonded by various processes. Made of specific materials, different carriers fit to different wafer materials to provide stability during processing. This is what distinguishes the Plan Optik range of Carrier Wafers: