PLANOPTIK AG manufactures customized interposers from glass, quartz and other materials – quality: made in Germany.
Featured Products
Through Glass Vias (TGV)
– Glass or Quartz Wafer with through holes
– high density
– high aspect ratio
– smooth edges
For more information visit our technology webpage vlis.tech
Interposer (Cu plated)
– TGV wafer or panel Cu plated
General properties
- patterned Interposers from Glass and Silica
- used for 2.5D / 3D Integration
- customer specific designs, patterns and alignment features
- high accuracy and low tolerance
Applications of glass interposers by PLANOPTIK
If you have a product idea or a project please do not hesitate to contact us!
Customized solutions like Cu-Interposers
With its new “Advanced Conncectivity Technology (ACT)” PLANOPTIK developed a solution to create or refine products for 3D-Integration, 5G or other connectivity and high frequency applications. PLANOPTIK offers Cu-Interposers as drilled glass wafers with a copper layer in sizes up to 300 mm, with hole diameters up to 75 µm (depending on wafer thickness). Customized Redistribution Layers (RDL) can be integrated on wafer sizes up to 8”. The wafer thickness ranges from 300 µm up to 1 mm. PLANOPTIK’s Cu-Interposers can be produced as wafers, panels or boards, depending on customer needs. With a minimum hole distance equal to via diameter and a Cu-layer thickness starting from 2 µm, Cu-Interposers are perfectly suitable for high-frequency applications like for example 5G broadband transmission, radar and imaging sensors, biosensors or beam steering networks.
