We have a new name. Plan Optik AG was renamed PLANOPTIK AG at the last Annual General Meeting. At the same time as the change of name, the PLANOPTIK Group is also getting a new logo. With the new brand, a new appearance and an overall new image, we want to be even better recognized…
Plan Optik AG presents Volume Laser Induced Structuring (VLIS), a next-generation solution designed to meet the demands of cutting-edge semiconductor applications. VLIS exemplifies advanced glass processing expertise, delivering unmatched performance and integration flexibility. The Importance of Through-Glass Vias (TGVs) Through-Glass Vias (TGVs) play a critical role in modern semiconductor applications, particularly in high-frequency and high-density…
The semiconductor industry is experiencing a significant shift towards the use of glass substrates, driven by their superior performance characteristics and suitability for high-frequency applications. As these trends gain momentum, Plan Optik AG is poised to play a critical role, thanks to its extensive expertise in glass wafer and panel manufacturing. The Rise of Glass…
Dear Valued Customers and Partners, Plan Optik AG is excited to introduce Wafer Universe, crafted to meet the urgent needs for standardized wafers with a focus on streamlining procurement and ensuring rapid delivery. Product Offerings: Borofloat33® Glass Wafers: Ideal for a wide range of applications, including Wafer-Level-Packaging (WLP) of MEMS components by anodic bonding. Quartz…
What are MEMS Microphones? MEMS Microphones are crafted using the advanced MEMS (Microelectromechanical systems) technologies. The heart of a MEMS Microphone is the sound sensing element, primarily formed from a silicon device wafer, which is further enclosed by a top-tier borosilicate glass wafer. How do MEMS Microphones work? Within the silicon device wafer lies a…
What are MEMS Gyroscopes? MEMS Gyroscopes are used for the detection of yaw-rate respectively angular-rate. They are manufactured by using MEMS (Microelectromechanical systems) technologies. The core part of a MEMS Gyroscope is an angular-rate sensing die based on a silicon device wafer, encapsulated by a high quality borosilicate glass wafer. General process flow How do…
What are Adapter Carriers? Adapter Carriers are customized tools enabling processing of smaller sized substrates or device wafers on bigger sized equipment (e.g. 6 inch device wafer on 8 inch equipment). The carrier diameter and thickness is matched to existing process tools such as thinning, dry etching, coating, implant, metal deposition, probing, etc.. What materials…
Plan Optik AG (Elsoff, Germany) and 4JET microtech (Alsdorf, Germany) have jointly developed a process chain for the highly productive production of metallized through-glass vias. The new VLIS process (short for Volume Laser Induced Structuring) enables the production of high-precision TGV (“Through Glass Vias”) for advanced packaging in glass wafers, or substrates for displays. TGV…
What are MEMS Pressure Sensors? MEMS Pressure Sensors are manufactured by using MEMS (Microelectromechanical systems) technologies. The core part of a MEMS Pressure Sensor is a pressure sensing die based on a silicon device wafer, encapsulated by a high quality borosilicate glass wafer. How do MEMS Pressure Sensors work? A membrane inside the silicon…
Plan Optik is the leading manufacturer of customized glass wafers. In sectors such as consumer electronics, automotive, aerospace, chemistry and pharmaceuticals these wafers are essential components for numerous applications in MEMS technology. The wafers of glass, glass-silicon compoundfs or quartz are available in sizes up to 300 mm diameter. Wafers by Plan Optik provide high-precision…
