Plan Optik AG, the leading manufacturer of structured wafers from glass, quartz and glass-silicon compound materials, has been nominated for the 2021 3DInCites Awards in the category “MATERIALS SUPPLIER OF THE YEAR“! Winners will be chosen by a select panel of judges, as well as industry peers through an online voting process. Online voting for the…
As technology is rapidly moving forward the reduction of device and chip size is playing an important role to be able to implement as many chips and sensors in smallest space. For this reason thickness reduction of the semiconductor wafers is necessary. Thin semiconductor wafers (thickness around 50-100 µm) are flexible and fragile. A temporary…
Elsoff. Plan Optik AG, the leading manufacturer of customized wafers from glass, quartz or glass-silicon compound materials has launched its new Cu-Interposer technology at SEMICON Europa 2019. The progressive miniaturization, increasing integration density and requirements for more powerful signal routing create the need for 3D integration. Interposer technologies for rewiring have been developed for efficient…