As technology is rapidly moving forward the reduction of device and chip size is playing an important role to be able to implement as many chips and sensors in smallest space. For this reason thickness reduction of the semiconductor wafers is necessary. Thin semiconductor wafers (thickness around 50-100 µm) are flexible and fragile. A temporary…
Elsoff. Plan Optik AG, the leading manufacturer of customized wafers from glass, quartz or glass-silicon compound materials has launched its new Cu-Interposer technology at SEMICON Europa 2019. The progressive miniaturization, increasing integration density and requirements for more powerful signal routing create the need for 3D integration. Interposer technologies for rewiring have been developed for efficient…
Sensors and Micro-Electro-Mechanical-Systems (MEMS) have changed the way how we interact with technology and how it interacts with itself and our environment. Without them we would not have smartphones, smart homes or wearable devices as smart watches as well as a huge range of industrial and medical devices that require the functionality provided by MEMS…
Elsoff. In order to serve the high demand of wafers with fixed specifications more quickly, Plan Optik AG has founded a new brand called Wafer Universe, to provide off the shelf products. Beside Plan Optik’s main business of customized wafers, Wafer Universe is going to handle the range of stock products. By separating those two…
Plan Optik AG, the leading manufacturer of wafers from glass and quartz for Semiconductor and MEMS applications, is proud to announce its collaboration with the Centre de Collaboration MiQro Innovation (C2MI) in Bromont, Canada. After successfully working with C2MI and members of their company network in the past years Plan Optik AG will from now…
1. Introduction There is ongoing wafer thickness reduction in the MEMS and semiconductor industry. This is because of market demand for smaller devices that afford an increased number of functionalities at reduced cost; and for this, smaller package sizes need to be realised. It is mainly consumer applications that are responsible for this trend, but…
Elsoff. Plan Optik AG expands its range of products which are available off the shelf to feature new materials! Additionally Plan Optik releases a product catalogue including all stock products with detailed information and specification! In respond to the increasing number of customers in need for blank wafers with fast delivery time Plan Optik AG,…
Plan Optik AG offers re-usable carriers for thin wafer handling which can be used for mechanical release of the device wafers. There is an ongoing wafer thickness reduction in the semiconductor industry since years. The market is demanding for smaller devices, cost reduction and increased number of functions. Therefore smaller package sizes need to be…
Plan Optik AG offers Carrier Wafers which enable handling of smaller diameter wafers and a variety of substrates with different dimensions. With increasing diameter of wafers processed in semiconductor industry not everyone can afford processing equipment or tools for different wafer diameter or even customized substrate dimensions. Plan Optik‘s Adapter Carriers feature pockets to hold…
Plan Optik AG, the leading manufacturer of glass and quartz wafers, now offers extremely thin wafers from glass and quartz. Standard wafer thicknesses for silicon wafers are ranging from 500 to 725 microns. Glass and quartz wafers are following these standard thicknesses and are used as substrates or for MEMS encapsulation since about 2 decades.…
