Carriers for mechanical release – Thin wafer handling

Plan Optik AG offers re-usable carriers for thin wafer handling which can be used for mechanical release of the device wafers. There is an ongoing wafer thickness reduction in the semiconductor industry since years. The market is demanding for smaller devices, cost reduction and increased number of functions. Therefore smaller package sizes need to be…

Adapter Carriers – Maximum Flexibility

Plan Optik AG offers Carrier Wafers which enable handling of smaller diameter wafers and a variety of substrates with different dimensions. With increasing diameter of wafers processed in semiconductor industry not everyone can afford processing equipment or tools for different wafer diameter or even customized substrate dimensions. Plan Optik‘s Adapter Carriers feature pockets to hold…

Thin wafers from glass and quartz

Plan Optik AG, the leading manufacturer of glass and quartz wafers, now offers extremely thin wafers from glass and quartz. Standard wafer thicknesses for silicon wafers are ranging from 500 to 725 microns. Glass and quartz wafers are following these standard thicknesses and are used as substrates or for MEMS encapsulation since about 2 decades.…

Thin wafer handling – Carriers for chemical release

From now on Plan Optik AG, the leading manufacturer of glass and quartz wafers, offers re-usable carriers for thin wafer handling which can be used for chemical release of device wafers. There has been an ongoing wafer thickness reduction in the semiconductor industry since many years. The market has demanded smaller devices, cost reductions and…

Quartz Wafers with extremely low roughness

Plan Optik AG, the leading manufacturer of structured Wafers is processing glass, quartz and similar materials since more than 40 years. This experience driven by the philosophy of permanently optimizing it’s processes in order to create the highest possible value for it’s customers leads to unbelievable results. From now on Plan Optik offers sub nanometer…